Mindy's Column
The principle and application of 3D packaging
The principle and application of 3D IC Packaging
The 2.5D mediating layer is a configuration in which the tube cores are installed side by side on ...
IC chip design, manufacturing to packaging
1, Complicated IC chip design process
The process of chip manufacturing is like building a house with LEGO. After the wafer is used as the foundati...
MEMS Microphone Packaging & IC Packaging Introduction
MEMS(Micro Electromechanical System) microphone is a microphone based on MEMS IC substrate technology. Simply put, a capacitor is integrated on a m...
Wafer level chip packaging technology
WLCSP, also known as wafer level chip scale packaging technology in English, is different from the traditional chip packaging method (cutting and t...
TBGA/Tape Ball Grid Array (BGA) PCBA Package Overview
TBGA/Tape Ball Grid Array (BGA) PCBA Package Overview
TBGA stands for Tape Ball Grid Array packaging which is part of the elec...