Mindy's Column
IC chip design, manufacturing to packaging
1, Complicated IC chip design process
The process of chip manufacturing is like building a house with LEGO. After the wafer is used as the foundati...
MEMS Microphone Packaging & IC Packaging Introduction
MEMS(Micro Electromechanical System) microphone is a microphone based on MEMS IC substrate technology. Simply put, a capacitor is integrated on a m...
Wafer level chip packaging technology
WLCSP, also known as wafer level chip scale packaging technology in English, is different from the traditional chip packaging method (cutting and t...
Introduction to Advanced Flip Chip Packaging Technology
Flip chip, as the name suggests, is a packaging method in which the front side of the chip (the side where the IC circuit is made) is connected to ...