Mindy's Column
The principle and application of 3D packaging
The principle and application of 3D IC Packaging
The 2.5D mediating layer is a configuration in which the tube cores are installed side by side on ...
MEMS Microphone Packaging & IC Packaging Introduction
MEMS(Micro Electromechanical System) microphone is a microphone based on MEMS IC substrate technology. Simply put, a capacitor is integrated on a m...
The Ultimate Guide to Arduino Nano Pinout
Arduino, a popular open-source platform, has taken the world of electronics and DIY projects by storm. The key to harnessing its full potential lie...
Will PCB be replaced by IC in the future?
Judging from the current terminal equipment sales market and its supply chain management feedback, the current requirements for printed circuit boa...
Introduction to Advanced Flip Chip Packaging Technology
Flip chip, as the name suggests, is a packaging method in which the front side of the chip (the side where the IC circuit is made) is connected to ...