Lisa's Column
Why Does a Ball Grid Array (BGA) Need Reballing?
Ball Grid Array (BGA) reballing is a process required for several key reasons related to the repair, upgrade, and maintenance of electronic compone...
4 Common BGA Rework Mistakes and How to Avoid Them
BGA (Ball Grid Array) rework is a complex process that requires precise execution to ensure successful repair and functionality. Here are four comm...
3 Common BGA Rework Challenges
Ball Grid Array (BGA) rework is a precise and complex process that presents several unique challenges. Addressing these challenges effectively is c...
Everything You Need to Know About BGA Soldering
Ball Grid Array (BGA) reballing is a process required for several key reasons related to the repair, upgrade, and maintenance of electronic compone...
Routing Rules of BGA package in PCB design
When routing a Ball Grid Array (BGA) package in PCB design, several important considerations should be kept in mind to ensure the integrity and fun...
Can't-Miss Layout Tips for BGA Chips
With the development of chip packaging technology, BGA (ball grid array) has been regarded as a standard packaging form. As far as chips with hund...
BGA Packaging Technology and Traditional SMT/SMD
SMT (surface mount technology) is presented relative to traditional THT (through hole technology). Compared with THT assembly, SMT assembly saves ...