Lily's Column
How to Use the Multimeter
A multimeter is a portable instrument that measures electrical quantities like voltage, current, and resistance. It is also known as a multitester,...
6 Layers impedance design
The impedance design of the outer trace is the same as that of the 4 layers board.
The inner trace is generally more plane layer than the surface t...
4 Layers impedance design
100 ohm differential impedance recommended design
line width, spacing 5/7/5mil differential pair and the distance between the pair ≥ 14mil (3W crit...
2 Layers Impedance Design
100 ohm differential impedance recommended design
Ground package design: line width/spacing 7/5/7mil ground wire width ≥20mil signal and ground wi...
What affect PCB impedance and how to calculate impedance
The impedance of the circuit board is determined by the physical dimensions (line wide/space) and materials of the circuit and is measured in Ohms ...
Impedance Matching in PCB Design
Impedance Matching in PCB Design
It is fair to consider a PCB itself as a component in which multiple traces are connected. Each trace is different...
What is Reflow Soldering?
Scheme of a reflow soldering process:
Step 1 Solder paste printing:After mixing and acclimating the solder paste, it is manually/automatically app...
What is Wave Soldering?
Wave soldering machines are mainly used for THT (Through-Hole Technology), components that (manually or fully automatically) are inserted through t...
What is a HDI PCB ?
HDI stands for High-Density Interconnector. Thus, HDI PCB is a special type of PCB that has the capability of high-density interconnections. In sim...
How to Reverse Engineer a Schematic From a Circuit Board
This project is a result of needing to service a domestic electronic item without being able to obtain a circuit diagram.The process proved to be v...
What is a capped via hole?
A capped via is when plating is added over the via hole so that the surface is fully metalized with a minimum copper / cap plating thickness of 5um...
Integrated Circuit Manufacturing Process
Wafer manufacturing and chip manufacturing are two steps to make integrated circuits. Wafer manufacturing includes two major steps, ingot manufactu...