Case 2: Motorola 1+2F+1
PCB features: 1+HDI design
BGA Pitch: 0.5mm
Flex board thickness: 25um without IVH hole design, the whole
PCB thickness: 0.275+/-0.028mm
Inner LW/SP: 3/3mil
Surface treatment: ENIG + Silver Paste
Process flow of Rigid-Flex PCB 2