DDR 3 PCB

The DDR 3 PCB is a third generation memory chip of the synchronous dynamic RAM PCB.

The DDR 3 PCB offers you superior performance advantages over its predecessors the DDR 2 and DDR 1. With the DDR 3 PCB, you benefit from data transfer speeds of over eight hundred megabits per second.

DDR refers to double data rate which attributes to a class of RAM PCBs with enhance data transfer speeds.

Using a RAM chip with DDR capability provides you more precise clock signal and electrical data timing.

DDR technology employs various strategies to achieve the needed timing accuracy like phase-locked loops and self-calibration.

 In doubling the data bus bandwidth without increasing clock frequency, the interface employs double pumping.

Double pumping refers to the transfer of data over both the clock signal’s rising and falling edges. Therefore, you note that the DDR 3 PCB has three times the doubling pumping capacity of a DDR 1 PCB.

Lowering the clock frequency has the benefit of reducing the requirements of signal integrity on the memory to controller circuit board.

What Technology Preceded The DDR 3 PCB?

Before the DDR 3 PCB, there was the DDR 2 which is the second generation memory class.

The DDR 2 offered significant performance boost over the DDR 1 running the external bus twice as quickly.

DDR 2 PCB offered increased sophistication than the DDR 1 with its memory cells capable of communication with an external bus.

The DDR 2 transfers data at double the clock speed just like DDR 1, except its bus is twice as fast.

Interface modifications, like employing off-chip drivers and pre-fetch buffers, allows you to achieve the boost in clock speed.

However, you experience twice a DDR 1’s latency by employing buffers, necessitating twice the speed of the bus speed in compensation.

The DDR 3 PCBs cost more than their DDR 2 predecessors due to the added circuitry and more stringent packaging needs.

The DDR 3 lowers the voltage supply requirement thus reducing the chip’s power consumption.

Employing a lower voltage of operation also improves running speed aside from reducing power consumption.

The DDR 3 PCB can transition between high and low statuses faster for similar slew rate thanks to less voltage swing.

Furthermore, the DDR 3 can set the data strobe to operate in differential mode.

Consequently, you reduce crosstalk, electromagnetic interference, noise and dynamic power consumption when you employ a differential signal.

What Are The Features Of A DDR 3 PCB?

You derive several advantages from employing the DDR 3 PCB over earlier generations. Some notable features of the DDR 3 PCB include:

• DQ Line Impedance: While the DDR 2 line impedance is 18 ohms, the DDR 3 PCB’s is 34 ohms.
• Higher Data Speeds: With a 400 MHz clock rate, the DDR 3 PCB delivers data speeds from 800 Mbps foe every pin.
• Lower Supply Voltage: Compared to the DDR 2’s 1.8 volts, the supply voltage of the DDR 3 PCB is 1.5 volts.
• Lower Power Consumption: Just lowering the voltage supply by a 0.69 factor decreases the equivalent chip power consumption.
• Memory Capacity: The DDR 3 PCB has memory capacities ranging from 512 Mb to 8 Gb.
• Memory Configurations: Like its predecessors, the DDR 3 PCB provides data output formats of x4, x8, and x16, but with eight banks.
• Mode Registers: You have four mode registers in DDR 3 PCBs unlike the DDR 2 which only utilized two.
• On-Die Termination (ODT): ODT allows for the application of proper terminations directly to the chip.
• Packages and Pins: You can employ surface mounting with the DDR 3 PCB such as the BGA (Ball Grid Array).
• Pre-fetch Buffer: In DDR 3 PCBs, the pre-fetch buffer rose to 8 bits, resulting in faster operation. The architecture allows the transfer of eight data words in four clock cycles.

What Is The Pin Count In A DDR 3 PCB?

The DDR 3 PCB offered considerable performance improvements resulting in extensive usage.

It allowed processors and computers to run at higher speeds, matching the performance gains made by other system parts.

A DDR 3 PCB has a total of 240 pins similar to the DDR 2 but with different notch/key locations. Consequently, you cannot interchange the two PCBs.

How Is The DDR 3 PCB Control Signal Operation?

The timing and operation of the control signals is critical since the DDR 3 PCB operates in a synchronous mode.

You identify numerous advantages of the DDR 3 PCB in terms of speed and operation.

The smooth operation of the DDR 3 PCB is dependent on the control signals’ timing and operation.

You have to appropriately manage the control line timing for successful operation of the DDR 3 PCB.

The DDR 3 PCB is a synchronous dynamic random access memory type with commands harmonized to the clock’s rising edge.

The memory can take a number of different activities influenced by the command signal’s state of the clock’s rising edges.

You find the following control signals useful in the operation of a DDR 3 PCB:

• Chip Select (CS): When you utilize many chips together, the CS permits activation of a particular DDR 3 PCB.

Usually the DDR 3 overlooks other inputs upon activation of this line save for the CE.

• Clock Enable (CE): At a low state the DDR 3 PCB deactivates upon a clock cycle completion.

Thus, there is no interpretation of commands regardless of other line status. Upon enabling to a high state, the DDR 3 PCB activates on the clock’s rising edge.

• Column Address Strobe (CAS): This control line, together with /RAS and /WE, implements a command out of eight total.
• Data Mask: This line represses input or output data when active. You have one of this lines for every 8 bits for a chip rated x16.
• Row Address Strobe (RAS): When activated alongside the column address strobe it allows the pursuit of one instruction from a pool of eight.
• Write Enable (WE): You employ this line alongside the row and column address strobes to differentiate read-only and write-only instructions.