The advantages of multi-layer stacking include:
- Higher circuit density, allowing for more components and circuits to be integrated.
- Better signal isolation, reducing crosstalk between signals.
- Improved signal integrity due to better impedance control.
- Enhanced heat dissipation capabilities through proper design.
- Space utilization efficiency is improved.
The disadvantages :
- Higher cost of manufacturing and materials.
- Design complexity is increased, requiring more sophisticated planning.
- Difficulty in testing and troubleshooting.
- There may be issues with layer-to-layer capacitance and inductance.
- Manufacturing process requirements are more stringent, with potential quality control challenges.