When making inter-layer connections in multi-layer stacking design, the following matters need to be noted:
1.Via design: Ensure that the size, quantity, and position of the vias are reasonable to meet the current-carrying capacity and signal transmission requirements. Avoid excessive via density leading to signal interference or heat dissipation problems.
2.Impedance control: Maintain the impedance continuity of the inter-layer connections to avoid signal reflection and distortion caused by impedance mutation.
3.Signal integrity: Consider the return path of the signal to avoid signal integrity problems such as crosstalk when the signal is transmitted between layers.
4.Power and ground connection: Provide sufficient and low-impedance inter-layer connections of power and ground to ensure power stability and good grounding.
5.Thermal management: The inter-layer connection should be conducive to the conduction and dissipation of heat to avoid local overheating affecting reliability.
6.Mechanical strength: Ensure the firmness of the inter-layer connection so that it can withstand certain mechanical stresses.
7.Manufacturability: The design should comply with the requirements of the manufacturing process to avoid difficult processing or high-cost situations.
8.Setting of test points: Reasonably plan the test points to facilitate the detection of the inter-layer connections in the subsequent testing and debugging.
9.Electromagnetic compatibility: Prevent unnecessary electromagnetic radiation or being too sensitive to external electromagnetic interference caused by the inter-layer connection.
10.Compatibility and standardization: Follow the relevant industry standards and specifications to ensure compatibility with other components and systems.