Radio frequency printed circuit board
There are different types of multilayer printed circuit board, depending on the intended application. Based on the types of RF PCBs that the design intends to come with, RF PCB design can be classified as:
1.Multilayer RF PCB Design
In multilayer RF PCB, the board has more than two layers. The least number of conductive layers in this kind of board is three. These conductive layers are buried in the center of the material.
Usually, you are supposed to do the alternation of the layers of prepreg and core materials. You will then proceed to laminate them together under high temperatures and pressure.
The result will be a multilayered PCB.
This procedure is important because it will help you in expelling trapped air between the layers. It further encapsulates the conductors with resin.
The adhesive holding the layers together are then melted and cured.
There are a number of materials combinations at your disposal when fabricating your multilayered RF PCB. You can use basic epoxy glass or even exotic ceramic.
Another option is to use Teflon materials.
2.Rigid RF PCB Design
Rigid RF PCBs are those that are made using solid substrate material. These prevent the board from twisting hence the term “rigid.”
FR4 stiffener is the most commonly used material in the stiffening process. It is also made up of copper trances and paths.
These are usually incorporated into the single board to provide room for connecting various components.
Traditionally, these rigid RF PCBs are the most commonly used compared to their flex PCB counterparts. This is mainly informed by the costs involved in using the latter.
Rigid RF PCB design requires the use of appropriate design software. Some preferred options here are Altium, Proteus, or EasyPC.
Rigid RF PCBs are composed of a number of layers. These layers are combined using heat and adhesive. This gives the board a solid shape.
The substrate layer is made of fiberglass. Note that additional heat will be required to laminate the copper layer onto the.
For insulation purposes, the design must incorporate adding a layer of solder mask above the copper layer.
Also, add silkscreen above the solder mask layer.
3.Single-Sided RF PCB Design
This is the simplest form of RF PCB board. The design has only one conductive material.
Single-sided PCBs are usually preferred for low-density designs.
Remember there is no plaiting through the holes on this board.
Single-sided RF PCBs mainly use materials for single-sided RF PCB include FR4, Aluminum and Copper base.
4.Double-Sided RF PCB Design
In this type of RF PCB, there are two conductive copper layers. This means that the board is designed with traces or paths on both sides. It means there is a connection between the two sides.
This is made possible by the holes that are drilled on the board. Mounting of components onto the board are done using through hole technology and surface mount technology.
This design provides for the lamination of layers on both sides of the board.
Glass epoxy resin is used as an insulating material at the base of the design. Copper foil is also laminated onto either sides of the substrate.
For protection, you will need to have soldermask above both sides of the RF PCB design.