Here are 7 common circuit board welding processes and their characteristics:
-
Manual Soldering:
- Characteristics: Allows for flexibility in soldering small and complex areas, but requires skill and can have inconsistent quality.
-
Wave Soldering:
- Characteristics: Suitable for mass production, efficient for through-hole components, but may have limitations for fine-pitch surface mount components.
-
Reflow Soldering:
- Characteristics: Mainly used for surface mount components, provides good solder joint quality and high throughput.
-
Selective Soldering:
- Characteristics: Enables targeted soldering of specific areas, offers more control compared to wave soldering.
-
Laser Soldering:
- Characteristics: Precise and can be used for very small or difficult-to-access areas, but may be costly.
-
Infrared Soldering:
- Characteristics: Can heat up components quickly, but may require careful temperature control.
-
Vapor Phase Soldering:
- Characteristics: Achieves uniform heating, but the equipment is relatively complex and expensive.