Information summary: One of the keys to designing high-speed power PCB boards is to minimize the voltage drop caused by line impedance and various noises introduced by high-frequency electromagnetic field conversion. There are usually two methods to solve the above...
One of the keys to designing high-speed power supply PCB boards is to minimize the voltage drop caused by line impedance and various noises introduced by high-frequency electromagnetic field conversion. There are usually two ways to solve the above problems. One is the power bus technology (POWER BUS), and the other is to use a separate power layer for power supply.
1. There should be a clear layout distinction between AC input and DC output, and the best way is to be able to isolate each other.
2. The wiring distance between the input and output ends (including the primary and secondary of DC/DC conversion) should be at least 5 mm.
3. There should be a clear layout distinction between the control circuit and the main power circuit.
4. Try to avoid parallel wiring of high current and high voltage wiring with measurement lines and control lines.
5. Copper is applied as much as possible on the blank board surface.
6. In the wiring connection of high current and high voltage, try to avoid using wires to connect over long distances in space, as the interference caused by it is difficult to deal with.
7. If the cost allows, multi-layer board wiring can be used, with a dedicated auxiliary power layer and ground layer, which will greatly reduce the impact of EMC.
8. The working ground is the most susceptible to interference, so try to adopt a large area of copper wiring.
9. The wiring of the shielded ground cannot form an obvious loop, otherwise it will form an antenna effect and easily introduce interference.
10. It is best to lay out high-power devices in a relatively regular manner to facilitate the installation of the radiator and the design of the heat dissipation duct.